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Home 2017

The kinetics of growth of high entropy alloy layers sputtered on Tungsten powder substrate

Author: Agnieszka Stefaniak, 76 (2017) 56-61

2024-02-24
Reading Time: 2 mins read
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ABSTRACT

Tungsten powder particles have been encapsulated with thin CrMnFeCoNi layers by magnetron sputtering method using high entropy alloy as a target. In the course of sputtering the powder surface has been periodically analyzed. The multimetallic coatings were being dissolved in 2 M HCl and the obtained solutions were analyzed by ICP method to determine Cr3+, Mn2+, Fe2+, Co2+ and Ni2+  ions concentration. The aim of the analysis was comparison of atomic proportions of the elements in the target and in obtained layer and indirect determining of the layer thickness.

 

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Tags: high entropy alloyICP analysismagnetron sputteringNanolayers
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