ABSTRACT
A thermoelectric leg (TML) model is formulated by using finite element analysis (FEA) implemented in COMSOL Multiphysics. In the modelling approach, segmented thermoelectric legs demonstrate higher efficiency compared to non-segmented configurations. The simulations were performed for TML devices fabricated from Cu₂Te, Cu₂BiSbTe, and Cu₂Bi₂Te₃ materials. Prototype of TML geometry with dimensions of 1 mm × 1 mm × 2 mm (width × depth × height) was employed. The finite element analysis study investigates the influence of temperature, thermoelectric leg height, inlet temperature, and material selection on device performance. At 450 K, Cu₂Bi₂Te₃ generates an electric potential approximately 24% higher than that of Cu₂BiSbTe. Furthermore, at 615 K, the calculated electric potential is nearly 20% higher than values obtained using physical constants measured at different temperatures. The simulation results yield a Seebeck coefficient of 141 μV/K for Cu₂Bi₂Te₃, indicating its superior thermoelectric performance among the investigated materials.
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